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| Previous Datasheet Index Next Data Sheet Provisional Data Sheet No. PD-9.1551 HEXFET(R) POWER MOSFET 400 Volt, 0.315 HEXFET HEXFET technology is the key to International Rectifier's advanced line of power MOSFET transistors. The efficient geometry achieves very low on-state resistance combined with high transconductance. HEXFET transistors also feature all of the well-establish advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and electrical parameter temperature stability. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers, and high energy pulse circuits. The Surface Mount Device (SMD-1) package represents another step in the continual evolution of surface mount technology. The SMD-1 will give designers the extra flexibility they need to increase circuit board density. International Rectifier has engineered the SMD-1 package to meet the specific needs of the power market by increasing the size of the termination pads, thereby enhancing thermal and electrical performance. IRFN350 N-CHANNEL Product Summary Part Number IRFN350 BVDSS 400V RDS(on) 0.315 ID 14A Features: s s s s s s s Avalanche Energy Rating Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed Surface Mount Light-weight Absolute Maximum Ratings Parameter I D @ VGS = 10V, TC = 25C ID @ VGS = 10V, TC = 100C IDM PD @ TC = 25C VGS EAS I AR EAR dv/dt TJ TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Package Mounting Surface Temperature Weight IRFN350 14 9 56 150 1.2 20 700 14 15 4.0 -55 to 150 300 (for 5 seconds) 2.6 (typical) Units A W W/K V mJ A mJ V/ns oC g To Order Previous Datasheet IRFN350 Device Index Next Data Sheet Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified) Parameter BVDSS Drain-to-Source Breakdown Voltage BV DSS/TJ Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current Min. 400 -- -- -- 2.0 6.0 -- -- -- -- 52 5.0 25 -- -- -- -- -- Typ. Max. Units -- 0.46 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0 -- -- 0.315 0.415 4.0 -- 25 250 100 -100 110 18 65 35 190 170 130 -- V V/C V S( ) A nA nC Test Conditions VGS = 0V, ID = 1.0mA Reference to 25C, ID = 1.0mA VGS = 10V, ID = 9A VGS = 10V, ID = 14A VDS = VGS, ID = 250A VDS > 15V, IDS = 9A VDS = 0.8 x Max Rating,VGS = 0V VDS = 0.8 x Max Rating VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VGS = 10V, ID = 14A VDS = Max. Rating x 0.5 see figures 6 and 13 VDD = 200V, ID = 14A, RG = 2.35, VGS = 10V see figure 10 Measured from the Modified MOSFET drain lead, 6mm (0.25 symbol showing the in.) from package to internal inductances. center of die. Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad. IGSS IGSS Qg Qgs Qgd t d(on) tr t d(off) tf LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance ns LS Internal Source Inductance -- 6.5 -- nH Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance -- -- -- 2600 680 250 -- -- -- pF VGS = 0V, VDS = 25V f = 1.0 MHz see figure 5 Source-Drain Diode Ratings and Characteristics Parameter IS I SM Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Min. Typ. Max. Units -- -- -- -- 14 56 Test Conditions Modified MOSFET symbol showing the integral reverse p-n junction rectifier. A VSD t rr Q RR t on Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Tj = 25C, I S = 14A, V GS = 0V Tj = 25C, IF = 14A, di/dt 100A/s VDD 50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by L S + LD. -- -- -- -- -- -- 1.7 1200 11 V ns C Thermal Resistance Parameter RthJC RthJ-PCB Junction-to-Case Junction-to-PC Board Min. Typ. Max. Units -- -- -- TBD 0.83 -- K/W Test Conditions Soldered to a copper clad PC board To Order Previous Datasheet IRFN350 Device Index Next Data Sheet Fig. 1 -- Typical Output Characteristics TC = 25C Fig. 2 -- Typical Output Characteristics TC = 150C ID = 14A Fig. 3 -- Typical Transfer Characteristics Fig. 4 -- Normalized On-Resistance Vs.Temperature I D = 14A Fig. 5 -- Typical Capacitance Vs. Drain-to-Source Voltage Fig. 6 -- Typical Gate Charge Vs. Gate-to-Source Voltage To Order Previous Datasheet IRFN350 Device Index Next Data Sheet 1000 OPERATION IN THIS AREA LIMITED BY RDS(on) ID , Drain Current (A) 100 10us 100us 10 1ms 1 TC = 25 C TJ = 150 C Single Pulse 10 100 10ms 1000 VDS , Drain-to-Source Voltage (V) Fig. 7 -- Typical Source-to-Drain Diode Forward Voltage Fig. 8 -- Maximum Safe Operating Area Fig. 9 -- Maximum Drain Current Vs. Case Temperature Fig. 10a -- Switching Time Test Circuit Fig. 10b -- Switching Time Waveforms To Order Previous Datasheet IRFN350 Device 1 0.50 Index Next Data Sheet Thermal Response (Z thJC ) 0.20 0.1 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) P DM t1 t2 Notes: 1. Duty factor D = t1 / t2 2. Peak T = P DM x Z thJC + TC J 0.0001 0.001 0.01 0.1 1 0.01 0.001 0.00001 t1 , Rectangular Pulse Duration (sec) Fig. 11 -- Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration Fig. 12a -- Unclamped Inductive Test Circuit Fig. 12b -- Unclamped Inductive Waveforms Fig. 12c -- Max. Avalanche Energy vs. Current Fig. 13a -- Gate Charge Test Circuit To Order Previous Datasheet IRFN350 Device Index Next Data Sheet Repetitive Rating; Pulse width limited by Fig. 13b -- Basic Gate Charge Waveform maximum junction temperature. (see figure 11) @ VDD = 50V, Starting TJ = 25C, EAS = [0.5 * L * (IL2) * [BVDSS/(BVDSS-VDD)] Peak IL = 14A, VGS = 10V, 25 RG 200 ISD 14A, di/dt 145A/s, VDD BV DSS, TJ 150C Pulse width 300 s; Duty Cycle 2% K/W = C/W W/K = W/C Case Outline and Dimensions -- SMD-1 All dimensions in millimeters (inches) WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 9/96 To Order |
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